Three-Dimensional Transient Electro-Thermal Interconnect Simulation for Stress and Electromigration Analysis
نویسندگان
چکیده
We introduce the coupling of three-dimensional transient electro-thermal interconnect simulations with intrinsic thermo-mechanical stress solutions. In order to study the development of local thermal stresses we use a finite element simulator for the investigation of complex layered interconnect structures at different operating conditions. The obtained local stress, temperature distribution, the current density, and the potential distribution represent the complete input data for accurate electromigration analysis.
منابع مشابه
Three-Dimensional Transient Electro-Thermal Simulation
We present a program package based on finite elements for twoand three-dimensional analysis of interconnect structures. Thereby, triangular and tetrahedral grid elements with quadratic shape functions are used. Two preprocessors allow a layer-based input of the simulation geometry and the specification of the boundary conditions. The main program calculates amongst other things the distribution...
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